Influence of Nano Cu2O additions on some physical properties of Sn-9Zn melt-spun solder alloy
X-ray diffraction (XRD), scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and surface deformation resistance (Vickers hardness HV) measurements have been used to examine the influence of Cu2O nanoparticles on some physical characteristics of the Sn-9Zn eutectic melt-spun solder alloy at various concentrations of 0, 0.5, 1, 2.5, and 5 wt.%. Five compositions of Sn-9 wt.% Zn-x wt.% Cu2O (x = 0, 0.5, 1, 2.5, and 5) were prepared from Sn, Zn elements, and Cu2O nanoparticles with a purity of 99.99% using melt-spinning method. XRD and SEM results indicated that adding Cu2O nanoparticles to the Sn-9Zn solder alloy produces a fine and high homogeneity microstructure. This is due to the grain boundary pinning effect by Cu2O nanoparticles, which are dispersed in the solder matrix, causing a uniform microstructure. DSC results exhibited that, as more Cu2O nanoparticles were added, thermal stability and a higher melting temperature were observed. Vickers hardness (HV) examinations showed that, Cu2O additives enhance the surface resistance for the plastic indentation with different loads. Just as with 25 gf, the smallest value is 5.5 HV without Cu2O content, while the highest value is 14.8 HV at 1 wt.% Cu2O content. This observation is because Cu2O nanoparticles increase structure density, which agrees with the SEM results.
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