Effect of the Cu additions on the structure of the soldered (96.5- x)Sn - (3.5)Ag -(x)Cu alloy with x=0.2, 0.4, 0.6, 0.8 and 1 wt % There is none
The microstructural characteristics of solder alloys critically determine their mechanical performance and reliability in high precision electronic applications. These characteristics including phase distribution, grain size, and intermetallic compound (IMC) formation govern the alloy’s response to thermal and mechanical stresses. Precise control of IMCs such as Cu6Sn5 and Ag3Sn, along with uniform fine grains, enhances toughness, creep resistance, and reduces fracture susceptibility. In this study, the effect of low copper additions (0.2–1 wt %) on the (96.5- x) Sn − 3.5Ag − xCu alloy was systematically investigated through a combination of XRD and SEM analyses. The results reveal a clear dependence of crystallite size, dislocation density, and IMC distribution on copper content and identify the optimal Cu concentration for stabilizing the β -Sn phase while improving mechanical properties. These findings provide a detailed understanding of microstructural evolution under low-Cu alloying, offering insights not addressed in previous studies.
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