The Effect of the Cu additions on the structure of the soldered (96.5- x)Sn - (3.5)Ag -(x)Cu alloy with x=0.2, 0.4, 0.6, 0.8 and 1 wt %: There is none. مجلة جامعة صنعاء للعلوم التطبيقية والتكنولوجيا, [S. l.], v. 4, n. 6, p. 2254–2264, 2026. DOI: 10.59628/jast.v4i6.2827. Disponível em: https://journals.su.edu.ye/index.php/jast/article/view/2827. Acesso em: 29 يونيو. 2026.